IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium
Source: LIANDAJIN ELECTRONIC Date:5/20/2013
BANNOCKBURN, Ill., USA, May 15, 2013 —
IPC — Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers. Sponsored by Lockheed Martin, the symposium will take place November 12–13, 2013, in Costa Mesa, Calif.
Expert presentations are sought on the full range of tin whiskers theory and practice in every market sector, including military/aerospace, aviation, medical, automotive, telecom and consumer. The content of the presentations should be noncommercial in nature and cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.
Those interested in presenting have until July 1 to submit an abstract of 250 to 300 words summarizing technical work that has not been previously published, a professional biography and complete contact information to Dr. Michael Osterman, CALCE operations director, at Osterman@calce.umd.edu. Authors will be notified of status by July 29, and will have a deadline of October 11 to provide completed papers and full presentation slides. |
